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Ansys 3 Diameter Thermal Simulation

Shimadzu Institute Nanotechnology Research Center

As an Undergraduate Researcher at the Shimadzu Institute Nanotechnology Research Center, I conducted comprehensive thermal management research for semiconductor photonics devices under Professor Zhou Weidong. I performed advanced thermal simulations using COMSOL Multiphysics and ANSYS to optimize heat sink geometries and laser diode cooling systems, demonstrating that straight fin designs achieve 28°C lower temperatures than wavy patterns under 40W loading. My research established critical design guidelines for high-power photonic devices.

I developed expertise in finite element analysis and thermal modeling, comparing multiple heat sink configurations and laser diode aperture sizes to establish quantitative thermal performance metrics. Through systematic simulation studies, I demonstrated that larger aperture sizes dramatically improve laser diode thermal performance, with 1.0mm diameter apertures achieving thermal resistance of 6.12°C/W compared to 48.87°C/W for 0.2mm apertures. This work provides directly applicable solutions for thermal challenges in semiconductor scaling and high-power laser applications.

Anthony Aiyedun Tag Photo
Wavy Heat Sink Solution
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